NY8888N/NY8888NP
低介電常數和低介質損耗 Low Dk 3.4@10GHz，Low Df 0.0014@10GHz
優異的電氣和熱可靠性 Excellent electrical and thermal reliability properties
優異的防潮性和無鉛回流焊工藝兼容 Excellent moisture resistance and lead Free reflow process compatible
優越的PTH可靠性和耐CAF能力 Superior PTH reliability and anti-CAF capability
高Tg及(ji)超低熱膨脹系數 High Tg and ultra-low the
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數據中心Data Centre
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AI服務器AI Server
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高性能計算機High Performance Computer
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超級核心路由器和交換機Super Core Router and Switcher
NY8888N基板典型性能 Typical Properties for NY8888N Laminate
| 屬性 Property | 項目 Item | 測試方法 IPC-TM-650 | 測試條件 Test Condition | 單位 Unit | 典型值 Typical Value | |
| 熱性能 Thermal | 玻璃態轉換溫度 Tg Glass Transition Temperature | 2.4.25 | DSC | ℃ | \ | |
| 2.4.24 | TMA | ℃ | 180 | |||
| 2.4.24.4 | DMA | ℃ | 220 | |||
| X/Y軸熱膨脹系數 X/Y-axis CTE | 2.4.24.5 | ＜Tg,TMA | PPM/℃ | 10\11 | ||
| Z軸熱膨脹系數 Z-axis CTE | 2.4.24 | ＜Tg,TMA | PPM/℃ | 50 | ||
| ＞Tg,TMA | PPM/℃ | 150 | ||||
| 2.4.24 | 50~260℃ | % | 1.8 | |||
| 熱分解溫度 Td Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 400 | ||
| 耐熱性 T288 Thermal Resistance | 2.4.24.1 | Clad | Min | ＞120 | ||
| Etched | Min | ＞120 | ||||
| 電性能 Electrical | 介電常數 Dk (R/C:65%) Permittivity | 1MHz | 2.5.5.9 | C-24/23/50 | — | \ |
| 1GHz | \ | |||||
| 10GHz | SPDR method | 3.17 | ||||
| 介質損耗 Df (R/C:65%) Loss Tangent | 1MHz | 2.5.5.9 | C-24/23/50 | — | \ | |
| 1GHz | — | \ | ||||
| 10GHz | SPDR method | 0.0012 | ||||
| 體積電阻 Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 2.4×109 | ||
| 表面電阻 Surface Resistivity | MΩ | 1.9×108 | ||||
| 物理性能 Physical | 吸水率 Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.06 | |
| 剝離強度(HTE) Peel Strength | 1oz | 2.4.8 | As Received | N/mm | \ | |
| 剝離強度(RTF) Peel Strength | 1oz | \ | ||||
| 剝離強度(HVLP) Peel Strength | 1oz | 0.6 | ||||
| 彎曲強度 Flexural Strength | Warp | 2.4.4 | As Received | N/mm? | 200 | |
| Fill | 180 | |||||
| 耐燃性 Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
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