NY6666/NY6666P
低介電常數和超低介質損耗
高Tg無鹵無鉛兼容
超低熱膨(peng)脹系(xi)數及優(you)異通(tong)孔(kong)可靠性(xing)低
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5G通訊及射頻5G Communication & Radio Frequency
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服務器及AI設備AI Server
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高性能計算機及交換機High performance computing & Switch
NY6666基板典型性能 Typical Properties for NY6666 Laminate
| 屬性 Property | 項目 Item | 測試方法 IPC-TM-650 | 測試條件 Test Condition | 單位 Unit | 典型值 Typical Value | |
| 熱性能 Thermal | 玻璃態轉換溫度 Tg Glass Transition Temperature | 2.4.25 | DSC | ℃ | \ | |
| 2.4.24 | TMA | ℃ | 200 | |||
| 2.4.24.4 | DMA | ℃ | \ | |||
| X/Y軸熱膨脹系數 X/Y-axis CTE（6*2116） | 2.4.24.5 | ＜Tg,TMA | PPM/℃ | 9\10 | ||
| Z軸熱膨脹系數 Z-axis CTE（6*2116） | 2.4.24 | ＜Tg,TMA | PPM/℃ | 43 | ||
| ＞Tg,TMA | PPM/℃ | 165 | ||||
| 2.4.24 | 50~260℃ | % | 1.4 | |||
| 熱分解溫度 Td Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 420 | ||
| 耐熱性 T288 Thermal Resistance | 2.4.24.1 | Clad | Min | ＞60 | ||
| Etched | Min | ＞60 | ||||
| 電性能 Electrical | 介電常數 Dk (R/C:55%/70%) Permittivity | 1MHz | 2.5.5.9 | C-24/23/50 | — | \ |
| 1GHz | 3.60\3.30 | |||||
| 10GHz | SPDR method | 3.90\3.50 | ||||
| 介質損耗 Df (R/C:55%/70%) Loss Tangent | 1MHz | 2.5.5.9 | C-24/23/50 | — | \ | |
| 1GHz | — | 0.0032\0.0029 | ||||
| 10GHz | SPDR method | 0.0038\0.0034 | ||||
| 體積電阻 Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 2.0×109 | ||
| 表面電阻 Surface Resistivity | MΩ | 1.0×108 | ||||
| 物理性能 Physical | 吸水率 Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| 剝離強度(HTE) Peel Strength | 1oz | 2.4.8 | As Received | N/mm | 0.8 | |
| 剝離強度(RTF) Peel Strength | 1oz | 0.6 | ||||
| 剝離強度(HVLP) Peel Strength | 1oz | 0.7 | ||||
| 彎曲強度 Flexural Strength | Warp | 2.4.4 | As Received | N/mm2 | 490 | |
| Fill | 449 | |||||
| 耐燃性 Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
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